Chengbin Pan is now doing his master in the pillar of Engineering Products Development of Singapore University of Technology and Design which is established with MIT. He is working with professor Pey Kin Leong (Associate provost) in the field of 2D dielectric characterization and its failure analysis for the application of h-BN based memory devices. The duration he works there starts at the first of July and ends at the 31st of December in 2016.
Chengbin Pan goes to Singapore University of Technology & Design
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