On July 4th – 7th, our group members Shaochuan Chen, Bin Yuan, Xianhu Liang and Mario Lanza participated in the 24th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) in Chengdu, China. In the conference, Prof. Mario Lanza was invited to give a tutorial talk on “Conductive atomic force microscopy and its use in nanoelectronic device reliability” and an invited talk on “TiO2/SiOx bilayer insulating stacks for filamentary/distributed resistive switching”. It’s a great experience to take part in the conference and we got the opportunity to interact with the top experts in the field.
Our group participates in the IPFA 2017 conference
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